Memory Module Technologies: TCP, EPOC and FEMMA
by Andy Hui on August 26, 2002 8:58 AM EST- Posted in
- Memory
Kentron Technologies, another pioneer
in memory solutions and best known for
their Quad Band Memory, have also tried their hand in creating something that
resolves the size issue.
The result is quite different to what Kingston and Elpida came up with. The Foldable Electronic Memory Module Assembly (FEMMA) technology involves two separate PCBs, connected via a flexible circuit tape component.
A half-open FEMMA Module
A closed FEMMA module from above
The result is quite different to what Kingston and Elpida came up with. The Foldable Electronic Memory Module Assembly (FEMMA) technology involves two separate PCBs, connected via a flexible circuit tape component.
A half-open FEMMA Module
A closed FEMMA module from above
Kentron's FEMMA platform again targets thermal dissipation, reliablility and
density. It is scalable to future
chip technologies such as BGA (Ball Grid Array) and Flash. Kentron also says
FEMMA is by nature a much lower cost alternative to the chip stacking method
also used for high-density platforms. FEMMA eliminates the high cost of stacking
chips, the yield "fall-out" of stacking and the significant time delay of the
stacking process.
Along with standard Desktop DIMMs, FEMMA is also available in the SO-DIMM
format.
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