5nm
While AMD's portfolio of embedded products doesn't receive quite as much attention as it should, it's not a product lineup to be underestimated. AMD's "fourth platform" covers a surprisingly wide range of chips for embedded devices and applications, ranging from miniscule chips for industrial computers and edge devices, all the way up to mighty EPYC processors designed for high throughput workloads. It's the latter that AMD is focusing on today, as Embedded World 2023 kicks off. A key fixture in the global trade show season for highlighting and releasing embedded and IoT solutions, AMD is using the show to unveil its EPYC Embedded 9004 series, its next generation of embedded processors based on its highly efficient Zen 4 microarchitecture. Derived from AMD's standard EPYC 9004...
ASML’s First Multi-Beam Inspection Tool for 5nm
ASML has announced it has made a significant development in its multi-beam inspectional tool line. The new eScan1000 moves a single beam scanning process into a nine-beam scanning process...
19 by Dr. Ian Cutress on 6/1/2020TSMC To Build 5nm Fab In Arizona, Set To Come Online In 2024
In a big shift to their manufacturing operations – and a big political win domestically – TSMC has announced that the company will be building a new, high-end fab...
100 by Ryan Smith on 5/15/2020Updated AMD Ryzen and EPYC CPU Roadmaps March 2020: Milan, Genoa, and Vermeer
Everyone is interested in roadmaps – they give us a sense of an idea of what is coming in the future, and for the investors, it gives a level...
60 by Dr. Ian Cutress on 3/5/2020TSMC & Broadcom Develop 1,700 mm2 CoWoS Interposer: 2X Larger Than Reticles
With transistor shrinks slowing and demand for HPC gear growing, as of late there has been an increased interest in chip solutions larger than the reticle size of a...
18 by Anton Shilov on 3/4/2020Intel CFO: Our 10nm Will Be Less Profitable than 22nm [Morgan Stanley Transcription]
This week at Morgan Stanley’s Analyst Conference, Intel’s CFO, George Davis, sat down to discuss the future of where Intel’s profitability lies. No stranger to the odd comments relating...
92 by Dr. Ian Cutress on 3/4/2020Samsung Starts Mass Production at V1: A Dedicated EUV Fab for 7nm, 6nm, 5nm, 4nm, 3nm Nodes
Samsung Foundry has started mass production of chips using its 6LPP and 7LPP manufacturing processes at its new V1 fab. The new facility employs one of the industry’s first...
30 by Anton Shilov on 2/20/2020TSMC Boosts CapEx by $1 Billion, Expects N5 Node to Be Major Success
TSMC is on track to begin high-volume production of chips using its 5 nm technology in the coming months, the company said in its conference call last week. While...
40 by Anton Shilov on 1/22/2020An Interview with AMD’s CTO Mark Papermaster: ‘There’s More Room At The Top’
On the back of a very busy 2019, AMD is gaining market share and is now a performance leader in a lot of CPU segments. The company has executed...
68 by Dr. Ian Cutress on 12/30/2019Early TSMC 5nm Test Chip Yields 80%, HVM Coming in H1 2020
Today at the IEEE IEDM Conference, TSMC is presenting a paper giving an overview of the initial results it has achieved on its 5nm process. This process is going...
64 by Dr. Ian Cutress on 12/11/2019Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm
One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...
138 by Dr. Ian Cutress on 12/11/2019TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm
TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...
27 by Anton Shilov on 10/23/2019TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019
Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...
18 by Anton Shilov on 10/18/2019New Tools & IP Accelerate Development of 5nm Arm ‘Hercules’ SoCs
Arm, Synopsys, and Samsung Foundry have developed a set of optimized tools and IP that will enable chip designers to build next-generation SoCs based on Arm’s Hercules processor cores...
9 by Anton Shilov on 10/10/2019Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...
12 by Dr. Ian Cutress on 8/20/2019Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track
Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since...
42 by Anton Shilov on 7/31/2019TSMC Announces Performance-Enhanced 7nm & 5nm Process Technologies
TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process. The company’s N7P and N5P technologies are designed for...
36 by Anton Shilov on 7/30/2019Samsung’s 5nm EUV Technology Gets Closer: Tools by Cadence & Synopsys Certified
Samsung Foundry has certified full flow tools from Cadence and Synopsys for its 5LPE (5 nm low-power early) process technology that uses extreme ultraviolet lithography (EUV). Full flow design...
13 by Anton Shilov on 7/8/2019Synopsys to Accelerate Samsung’s 7nm Ramp with Yield Explorer Platform
Synopsys has announced an acceleration of development on its yield learning platform designed to speed up ramp up of chips made using Samsung Foundry’s 7LPP (7 nm low power...
16 by Anton Shilov on 7/4/2019Samsung Completes Development of 5nm EUV Process Technology
Samsung Foundry this week announced that it has completed development of its first-generation 5 nm fabrication process (previously dubbed 5LPE). The manufacturing technology uses extreme ultraviolet lithography (EUVL) and...
21 by Anton Shilov on 4/17/2019TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready
TSMC this week has said that it has completed development of tools required for design of SoCs that are made using its 5 nm (CLN5FF, N5) fabrication technology. The...
33 by Anton Shilov on 4/5/2019