OCZ 3700 GOLD: Building High-Performance Memoryby Wesley Fink on August 7, 2003 8:34 PM EST
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One of the first memory modules to reach stable DDR500 performance levels was OCZ 3700 GOLD. Many of us at AnandTech have been impressed with the performance levels and timings we have seen with this memory. We were a bit surprised, therefore, when we learned that this memory was reportedly achieving these performance levels using Samsung TCB3 memory chips.
The surprise was not that OCZ was using Samsung chips in 3700 GOLD — it is common knowledge that almost every high-end memory manufacturer builds their modules with memory from a wide range of memory chip makers. They may order custom blanks, custom label, or do special "binning" to choose chips for their DIMMs, but virtually all of the custom memory makers use chips from huge memory makers like Samsung, Micron, and Hynix. The surprise in this case was the Samsung chips OCZ was using. We had seen the chips used in DDR333 and DDR400 DIMMs from Samsung and a few other manufacturers. In fact, we had a pair of Crucial DDR333 DIMMs that used Samsung chips with the same ID. We wondered how OCZ was able to get these DDR333/400 chips to perform at the stable DDR466/500 levels, which we had seen in our OCZ 3700 GOLD tests for the upcoming article, 'Searching for the Memory Holy Grail — Part 2'.