Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it's first-generation GAAFET N2 node in the second half of 2025, and N2P will succeed N2 in late 2026 – albeit without the previously-announced backside power delivery capabilities. Meanwhile, the whole N2 family will be adding TSMC's new NanoFlex capability, which allows chip designers to mix and match cells from different libraries to optimize performance, power, and area (PPA). One of the key announcements of the event is TSMC's NanoFlex technology, which will be a part of the company's complete N2...

TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power

With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play...

18 by Anton Shilov on 4/25/2024

Intel to use Nanowire/Nanoribbon Transistors in Volume ‘in Five Years’

This year, at the international VLSI conference, Intel’s CTO Mike Mayberry gave one of the plenary presentations, which this year was titled ‘The Future of Compute’. Within the presentation...

14 by Dr. Ian Cutress on 6/22/2020

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