DRAM

Rambus has introduced its fourth-generation registering clock driver (RCD) chip for server-grade DDR5 memory modules. The updated RCD chip brings support for higher clockspeeds on DDR5 RDIMMs, allowing for future RDIMMs to run as fast as DDR5-7200, a step ahead of their current third-generation/DDR5-6400 RCD. Faster DDR5 RDIMMs will eventually go hand-in-hand with upcoming server platforms, with AMD, Intel, and others all eyeing significantly higher memory speeds for their next round of products. An RCD functions as a buffer between the memory controller and DRAM chips in RDIMMs, redistributing command and address signals across the module – and making up the "Registered" in "Registered DIMM". This enhances signal integrity and enables more memory devices to be connected to a single DRAM channel. To work properly...

G.Skill and V-Color Unveil Factory Overclocked ECC RDIMMs for Ryzen Threadripper 7000 [UPDATED]

UPDATE 11/24: Demu, our reader with sharp eyes, notified us that Gigabyte had published a list of overclockable RDIMMs with ECC and AMD EXPO profiles supported by its TRX50...

7 by Anton Shilov on 11/23/2023

Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die

The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging...

15 by Ganesh T S on 11/9/2023

Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs

Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32...

9 by Anton Shilov on 9/28/2023

Corsair's Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s

Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together luxurious look, customizable design, and extreme data transfer...

1 by Anton Shilov on 9/26/2023

Samsung Unveils Industry's First 32Gbit DDR5 Memory Die: 1TB Modules Incoming

Samsung early on Friday revealed the world's first 32 Gb DDR5 DRAM die. The new memory die is made on the company's 12 nm-class DRAM fabrication process and not...

6 by Anton Shilov on 9/1/2023

SK hynix Begins Sampling HBM3e, Volume Production Planned For H1 2024

SK hynix on Monday announced that it had completed initial development of its first HBM3E memory stacks, and has begun sampling the memory to a customer. The updated ("extended"...

4 by Anton Shilov on 8/21/2023

SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC

On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company's LPDDR5X-8500 devices...

10 by Anton Shilov on 8/11/2023

Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB

This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions. Modern server platforms from...

7 by Anton Shilov on 8/9/2023

TeamGroup Unveils JEDEC-Spec DDR5-6400 Memory Kits: Faster 1.1V DDR5 On The Way For Future CPUs

While DDR5 memory has been out and in use for a couple of years now, so far we haven't seen the memory reach its full potential – at least...

5 by Anton Shilov on 7/31/2023

Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND

Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...

14 by Anton Shilov on 7/28/2023

Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext

In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...

4 by Anton Shilov on 7/27/2023

Cadence Buys Memory and SerDes PHY Assets from Rambus

In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...

5 by Anton Shilov on 7/24/2023

G.Skill's 24GB DDR5-6000 Modules with AMD EXPO Profiles Released

G.Skill has quietly started selling its 24 GB DDR5 memory modules with AMD EXPO profiles for single-click overclocking. G.Skill's Trident Z5 Neo RGB modules are among the first EXPO-profiled...

4 by Anton Shilov on 6/28/2023

TeamGroup Announces T-Force Xtreem ARGB DDR5 Memory: Up to DDR5-8266

At Computex 2023, TeamGroup unveiled two additions to its extensive family of memory products. Available with ARGB heatsinks or subtle black non-RGB heatsinks, the TeamGroup T-Force Xtreem DDR5 memory...

5 by Gavin Bonshor on 6/2/2023

Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex

Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now...

4 by Anton Shilov on 6/2/2023

Corsair Unveils Dominator Titanium DDR5 Kits: Reaching For DDR5-8000

Corsair has introduced its new Dominator Titanium series of DDR5 memory modules that will combine performance, capacity, and style. The new lineup of memory modules and kits will offer...

5 by Anton Shilov on 5/30/2023

SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s

SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this...

5 by Anton Shilov on 5/30/2023

Micron Expects Impact as China Bans Its Products from 'Critical' Industries

In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning...

12 by Anton Shilov on 5/23/2023

Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025

Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use...

10 by Anton Shilov on 5/19/2023

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