4nm
TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in loans under the CHIPS and Science Act. With this latest round of support from the U.S. government, TSMC in turn will be adding a third fab to their Arizona project, with its investment in the region soaring to more than $65 billion. This move not only signifies the largest foreign direct investment in Arizona but also marks one of the biggest support packages that the U.S. government plans to make under the CHIPS Act, second only to Intel's $8.5 billion award last month. TSMC is currently equipping its Fab 21 phase 1 and expects that it...
AMD Fixed the STAPM Throttling Issue, So We Retested The Ryzen 7 8700G and Ryzen 5 8600G
When we initially reviewed the latest Ryzen 8000G APUs from AMD last month, the Ryzen 7 8700G and Ryzen 5 8600G, we became aware of an issue that caused...
7 by Gavin Bonshor on 2/23/2024
AMD Set to Fix Ryzen 8000G APU STAPM Throttling Issue, Sustained Loads Affected
Earlier this week, we published our review of AMD's latest Zen 4 based APUs, the Ryzen 7 8700G and Ryzen 5 8600G. While we saw much better gaming performance...
23 by Gavin Bonshor on 2/2/2024
AMD Ryzen 7 8700G and Ryzen 5 8600G Review: Zen 4 APUs with RDNA3 Graphics
One of the most desired desktop chips designed for low-cost systems has been AMD's APUs or Accelerated Processing Units. The last time we saw AMD launch a series of...
111 by Gavin Bonshor on 1/29/2024
AMD Unveils Ryzen 8040 Mobile Series APUs: Hawk Point with Zen 4 and Ryzen AI
Although CES 2024 is happening next month in Las Vegas, AMD has lifted the lid on their latest Zen 4 mobile processors, the Ryzen Mobile 8040 series. Codenamed Hawk...
24 by Gavin Bonshor on 12/6/2023
Samsung's Next-Gen 3nm and 4nm Nodes on Track for Mass Production in 2H 2024
Samsung is set to start making chips using its 2nd Generation 3nm-class (SF3) manufacturing technology as well as performance-enhanced version of its 4nm-class (SF4X) fabrication process in the second...
9 by Anton Shilov on 11/2/2023
Tenstorrent to Use Samsung’s SF4X for Quasar Low-Cost AI Chiplet
Tenstorrent this week announced that it had chosen to use Samsung's SF4X (4 nm-class) process technology for its upcoming low-cost, low-power codenamed Quasar chiplet for machine learning workloads. The...
13 by Anton Shilov on 10/3/2023
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...
27 by Anton Shilov on 7/20/2023
Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report
Currently, only two foundries offer their customers 3 nm and 4 nm-class process technologies: TSMC and Samsung Foundry. But business media sometimes blames Samsung Foundry for mediocre yields on...
5 by Anton Shilov on 7/18/2023
TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage
At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable...
5 by Anton Shilov on 5/26/2023
Samsung to Unveil Refined 3nm and Performance-Enhanced 4nm Nodes at VLSI Symposium
Samsung Foundry is set to detail its second generation 3 nm-class fabrication technology as well as its performance-enhanced 4 nm-class manufacturing process at the upcoming upcoming 2023 Symposium on...
3 by Anton Shilov on 5/10/2023
Samsung Foundry Vows to Surpass TSMC Within Five Years
The head of Samsung's semiconductor unit acknowledged last week that the company's current mass production, leading-edge process technologies are a couple of years behind TSMC's most advanced production nodes...
18 by Anton Shilov on 5/8/2023
TSMC Announces Early Access Nodes for Next-Gen Car Chips: N4AE and N3AE
As the final set of announcements from this week's North American Technology Symposium, TSMC closed out their fab roadmap updates with some fresh news on their automotive-centric processes. For...
10 by Anton Shilov on 4/28/2023
Asus Preps ROG Ally: A Portable Windows Game Console with Custom Zen 4 + RDNA 3 APU
Asus has begun teasing its own portable game console, the ROG Ally, which the company is positioning as a high-end offering for the handheld PC gaming market. With its...
18 by Anton Shilov on 4/5/2023
Inflation Drives Up Fab Costs for Intel and Samsung by Billions of Dollars
To address future demand for semiconductors amid severe chip shortages of 2020 – 2022, all leading chipmakers announced plans to build new fabs and even disclosed their estimated costs...
15 by Anton Shilov on 3/16/2023
AMD Lays Out 2023 Ryzen Mobile 7000 CPUs: Top-to-Bottom Updates, New Zen 4 'Phoenix' CPU Takes Point
This year’s CES has turned out to be a laptop-centric event in the PC space, and no farther do you have to look for proof of that than AMD’s...
46 by Ryan Smith on 1/4/2023
TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard
TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...
13 by Anton Shilov on 7/21/2022
AMD: We’re Using an Optimized TSMC 5nm Process
When AMD started using TSMC’s 7nm process for the Zen 2 processor family that launched in November 2019, one of the overriding messages of that launch was that it...
44 by Dr. Ian Cutress on 1/10/2022
TSMC Unveils N4X Node: Extreme High-Performance at High Voltages
TSMC this week announced a new fabrication process that is tailored specifically for high-performance computing (HPC) products. N4X promises to combine transistor density and design rules of TSMC's N5-family...
42 by Anton Shilov on 12/17/2021
TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025
TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...
32 by Anton Shilov on 10/18/2021
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