3D NAND
When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster, a major project announced in April 2021 and valued at $106 billion. While development of the site has been largely completed, only 35% of the initial shell building has been constructed, according to the Korean Ministry of Trade, Industry, and Energy. "Approximately 35% of Fab 1 has been completed so far and site renovation is in smooth progress," a statement by the Korean Ministry of Trade, Industry, and Energy reads. "By 2046, over KRW 120 trillion ($90 billion today, $106 billion in 2021) in investment will be poured to complete Fabs 1 through 4, and construction...
Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter
As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...
10 by Anton Shilov on 4/1/2020
28 TB of Storage in a Laptop? Eurocom Has It
Proving that where there's a will, there's a way, these days higher-end desktop replacement laptops can beat mainstream gaming desktops on general-purpose computing performance, graphics performance, and even RAM...
38 by Anton Shilov on 2/14/2020
SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020
Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...
6 by Anton Shilov on 2/3/2020
Western Digital Roadmap Updates: Energy Assisted Recording, Multi-Stage Actuators, Zoned Storage
Between CES at the beginning of the month, a series of presentations at Storage Field Day last week and a quarterly earnings report this week, we've heard from just...
115 by Billy Tallis on 1/31/2020
Western Digital and Kioxia Announce BiCS5 112-Layer 3D NAND
Western Digital and Kioxia have announced the successful development of their newest generation of 3D NAND flash memory. Their fifth-generation BiCS 3D NAND has commenced production in the form...
19 by Billy Tallis on 1/30/2020
CES 2020: Patriot Goes Big on Bandwidth For New EVLVR 2 TB3 SSDs
At this year's CES, Patriot has introduced an enhanced version of its EVLVR (Evolver) Thunderbolt 3 external SSD. The new drive is set to offer radically improved sequential read/write...
5 by Anton Shilov on 1/10/2020
CES 2020: Patriot Demonstrates PXD External SSD w/ USB-C
Among the many storage vendors at this year's CES was Patriot, who was showcasing its upcoming PXD external SSD. The device features a USB 3.1 Gen 2 Type-C interface...
5 by Anton Shilov on 1/9/2020
Fire At Kioxia & Western Digital NAND Fab - Impact on Supply to be Minimal
Kioxia has reportedly informed its customers that a production tool at one of its fabs caught fire early on Tuesday. The fire was promptly extinguished and no casualties were...
6 by Anton Shilov on 1/8/2020
Samsung’s Fab in Hwaseong Suffers Power Outage
Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...
48 by Anton Shilov on 1/2/2020
AnandTech Year In Review 2019: Solid State Drives
In 2019, flash memory prices have leveled out and have even crept back upward a bit, and new technologies have been slow to roll out, although we are currently...
42 by Billy Tallis on 12/31/2019
Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future
One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...
23 by Dr. Ian Cutress on 12/30/2019
Samsung to Expand 3D NAND Fab in China
Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...
5 by Anton Shilov on 12/17/2019
Macronix to Start Shipments of 3D NAND in 2020
Macronix, a Taiwan-based manufacturer for special-purpose memory solutions, will start volume shipments of its own 3D NAND memory in the second half of next year. The company will become...
3 by Anton Shilov on 12/11/2019
NAND Flash Revenue Peaks in Q3 Amid Production Cuts & Outages
Despite cuts in wafer starts by almost all NAND producers, and even disruptions in Kioxia (former Toshiba Memory) and Western Digital's fab operations, analysts estimate that bit shipments of...
10 by Anton Shilov on 12/4/2019
SK Hynix Sampling 128-layer 3D NAND SSDs
SK Hynix announced this week that they have started sampling products based on their 128-layer 3D NAND flash memory, which will soon start showing up in end-user devices. A...
9 by Billy Tallis & Anton Shilov on 11/21/2019
Kioxia Expands Automotive Grade eUFS Lineup: 512 GB for Extreme Conditions
Kioxia (formerly Toshiba Memory), has expanded its lineup of embedded UFS (eUFS) storage with a 512 GB device based on the company’s BiCS 3D NAND flash. The chip is...
5 by Anton Shilov on 11/15/2019
Western Digital Begins Shipments of 96-Layer 3D QLC-Based SSDs, Retail Products
Western Digital announced this week that it has started shipments of its first products based on 3D QLC NAND memory. The initial devices to use the highly-dense flash memory...
28 by Anton Shilov on 11/1/2019
Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon
Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...
10 by Anton Shilov on 10/4/2019
Goke Unveils Toshiba XL-Flash-Based NVMe SSDs: Ultra-Low Latency
Goke Microelectronics has introduced its new NVMe SSDs based on Toshiba’s XL-Flash NAND memory. The new drives are aimed at applications that require an ultra-low latency as well as...
8 by Anton Shilov on 10/2/2019
YMTC Starts Volume Production of 64-Layer 3D NAND
Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...
4 by Anton Shilov on 9/5/2019
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